All times refer to time zone CET
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08:15
A6
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Opening
- Alfred Vollmer
- Editor-in-Chief
- Bodo’s Power Systems
- (No session description available yet)
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08:30
G1
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Presentation title to be confirmed…
- Dr. Alex Lidow
- CEO and Co-founder
- Efficient Power Conversion (EPC)
- To be confirmed…
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08:45
G2
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Presentation title to be confirmed…
- Harald Parzhuber
- Systems Manager, Energy Infrastructure
- Texas Instruments
- To be confirmed…
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09:00
G3
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Presentation title to be confirmed…
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- Infineon Technologies
- To be confirmed…
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09:15
G4
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Presentation title to be confirmed…
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- Toshiba Electronics
- To be confirmed…
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09:30
G5
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Presentation title to be confirmed…
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- To be confirmed…
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09:45
B1
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Coffee Break & Tabletop Exhibition
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- All breaks and catering, as well as the tabletop exhibition, will take place in the foyer.
The perfect spot for networking and learning about the latest products and services!
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10:30
G6
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Presentation title to be confirmed…
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- STMicroelectronics
- To be confirmed…
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10:45
G7
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Presentation title to be confirmed…
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- X-FAB
- To be confirmed…
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11:00
G8
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Presentation title to be confirmed…
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- ROHM Semiconductor
- To be confirmed…
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11:15
G9
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Presentation title to be confirmed…
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- NXP Semiconductors
- To be confirmed…
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11:30
G10
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Presentation title to be confirmed…
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- Renesas
- To be confirmed…
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11:45
G11
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Presentation title to be confirmed…
- Llew Vaughan-Edmunds
- Senior Director, Product Management
- Navitas Semiconductor
- To be confirmed…
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12:00
B2
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Lunch Break & Tabletop Exhibition
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- All breaks and catering, as well as the tabletop exhibition, will take place in the foyer.
The perfect spot for networking and learning about the latest products and services!
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13:30
G12
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Presentation title to be confirmed…
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- Power Integrations
- To be confirmed…
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13:45
G13
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Presentation title to be confirmed…
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- Bourns
- To be confirmed…
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14:00
G14
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Presentation title to be confirmed…
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- Infineon Technologies
- To be confirmed…
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14:15
G15
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Presentation title to be confirmed…
- Dieter Liesabeths
- SVP of Product
- VisIC Technologies
- VisIC Technologies introduces its latest D3GaN™ power module, optimized for Battery Electric Vehicle (BEV) inverter applications. Featuring ultra-low inductance of just 4nH, the module supports high-voltage operation at 650V and delivers current capabilities exceeding 400A. Designed for demanding automotive environments, it incorporates a robust gate structure that ensures reliable performance under inductive load conditions. The gate drive range of 0 to 20V, combined with a high threshold voltage (Vth > 7V), enhances noise immunity and switching stability. This module sets a new benchmark for efficiency, power density, and ruggedness in next-generation EV drivetrain systems. The Module can support up to over 100kW inverter applications. Measurement results and switching energies will be presented together with available evaluation systems.
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14:30
G16
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Presentation title to be confirmed…
- Dr. Samaneh Sharbati
- Associate Professor
- University of Southern Denmark
- To be confirmed…
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14:45
B3
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Coffee Break & Tabletop Exhibition
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- All breaks and catering, as well as the tabletop exhibition, will take place in the foyer.
The perfect spot for networking and learning about the latest products and services!
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15:30
G17
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GaN In-Circuit Reliability: Dynamic Life Testing of 650V GaN FETs
- Dr. Jim Honea
- GaN Applications Director
- Nexperia
- To be confirmed…
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15:45
G18
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Presentation title to be confirmed…
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- Cambridge GaN Devices (CGD)
- To be confirmed…
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16:00
G19
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Presentation title to be confirmed…
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- MinDCet
- To be confirmed…
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16:15
G20
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Improving GaN Model Accuracy
- Dr. Stefania Carapezzi
- Field Applications Engineer
- Silvaco
- Engineers continue to work on understanding the complex interaction of materials, geometry and quantum effects at the heart of GaN devices. The accuracy of physics-based simulation models is vital to allow full device design and optimization prior to manufacturing. This presentation will look at effects such as the two-dimensional electron gas (2DEG) and the phenomenon of current collapse in GaN high-electron-mobility transistors (HEMTs), caused by electron trapping. This effect can limit device performance, especially at high frequencies. The presentation will also show how parameters of TCAD models can be efficiently matched with real-life measurements by a ML-TCAD combined strategy, boosting the time-consuming traditional trial-and-error procedures, and validating the predictivity of TCAD simulations.
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16:30
G21
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Presentation title to be confirmed…
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- Rohde & Schwarz
- To be confirmed…
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