Day 2 - December 3th, 2025

Bodo's WBG - GaN

Welcome to the program for the GaN track, which will be held in room Munich II at the Hilton Munich Airport. Below you can see the companies we have invited to present. Please note, there will be no public call for papers, the event is “invite only”. You can expect the contributions to be highly technical.

All times refer to time zone CET

Klick title to show / hide detailed session description

08:15
A6
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Opening
  Alfred Vollmer
 Editor-in-Chief
 Bodo’s Power Systems
(No session description available yet)
08:30
G1
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Presentation title to be confirmed…
  Dr. Alex Lidow
 CEO and Co-founder
 Efficient Power Conversion (EPC)
To be confirmed…
08:45
G2
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Presentation title to be confirmed…
  Harald Parzhuber
 Systems Manager, Energy Infrastructure
 Texas Instruments
To be confirmed…
09:00
G3
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Presentation title to be confirmed…
  
 
 Infineon Technologies
To be confirmed…
09:15
G4
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Presentation title to be confirmed…
  
 
 Toshiba Electronics
To be confirmed…
09:30
G5
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Presentation title to be confirmed…
  
 
 
To be confirmed…
09:45
B1
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Coffee Break & Tabletop Exhibition
  
 
 
All breaks and catering, as well as the tabletop exhibition, will take place in the foyer.
The perfect spot for networking and learning about the latest products and services!
10:30
G6
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Presentation title to be confirmed…
  
 
 STMicroelectronics
To be confirmed…
10:45
G7
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Presentation title to be confirmed…
  
 
 X-FAB
To be confirmed…
11:00
G8
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Presentation title to be confirmed…
  
 
 ROHM Semiconductor
To be confirmed…
11:15
G9
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Presentation title to be confirmed…
  
 
 NXP Semiconductors
To be confirmed…
11:30
G10
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Presentation title to be confirmed…
  
 
 Renesas
To be confirmed…
11:45
G11
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Presentation title to be confirmed…
  Llew Vaughan-Edmunds
 Senior Director, Product Management
 Navitas Semiconductor
To be confirmed…
12:00
B2
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Lunch Break & Tabletop Exhibition
  
 
 
All breaks and catering, as well as the tabletop exhibition, will take place in the foyer.
The perfect spot for networking and learning about the latest products and services!
13:30
G12
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Presentation title to be confirmed…
  
 
 Power Integrations
To be confirmed…
13:45
G13
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Presentation title to be confirmed…
  
 
 Bourns
To be confirmed…
14:00
G14
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Presentation title to be confirmed…
  
 
 Infineon Technologies
To be confirmed…
14:15
G15
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Presentation title to be confirmed…
  Dieter Liesabeths
 SVP of Product
 VisIC Technologies
VisIC Technologies introduces its latest D3GaN™ power module, optimized for Battery Electric Vehicle (BEV) inverter applications. Featuring ultra-low inductance of just 4nH, the module supports high-voltage operation at 650V and delivers current capabilities exceeding 400A. Designed for demanding automotive environments, it incorporates a robust gate structure that ensures reliable performance under inductive load conditions. The gate drive range of 0 to 20V, combined with a high threshold voltage (Vth > 7V), enhances noise immunity and switching stability. This module sets a new benchmark for efficiency, power density, and ruggedness in next-generation EV drivetrain systems. The Module can support up to over 100kW inverter applications. Measurement results and switching energies will be presented together with available evaluation systems.
14:30
G16
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Presentation title to be confirmed…
  Dr. Samaneh Sharbati
 Associate Professor
 University of Southern Denmark
To be confirmed…
14:45
B3
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Coffee Break & Tabletop Exhibition
  
 
 
All breaks and catering, as well as the tabletop exhibition, will take place in the foyer.
The perfect spot for networking and learning about the latest products and services!
15:30
G17
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GaN In-Circuit Reliability: Dynamic Life Testing of 650V GaN FETs
  Dr. Jim Honea
 GaN Applications Director
 Nexperia
To be confirmed…
15:45
G18
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Presentation title to be confirmed…
  
 
 Cambridge GaN Devices (CGD)
To be confirmed…
16:00
G19
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Presentation title to be confirmed…
  
 
 MinDCet
To be confirmed…
16:15
G20
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Improving GaN Model Accuracy
  Dr. Stefania Carapezzi
 Field Applications Engineer
 Silvaco
Engineers continue to work on understanding the complex interaction of materials, geometry and quantum effects at the heart of GaN devices. The accuracy of physics-based simulation models is vital to allow full device design and optimization prior to manufacturing. This presentation will look at effects such as the two-dimensional electron gas (2DEG) and the phenomenon of current collapse in GaN high-electron-mobility transistors (HEMTs), caused by electron trapping. This effect can limit device performance, especially at high frequencies. The presentation will also show how parameters of TCAD models can be efficiently matched with real-life measurements by a ML-TCAD combined strategy, boosting the time-consuming traditional trial-and-error procedures, and validating the predictivity of TCAD simulations.
16:30
G21
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Presentation title to be confirmed…
  
 
 Rohde & Schwarz
To be confirmed…