Day 2 - December 4th, 2024

Bodo's WBG - SiC

Welcome to the program for the SiC track, which will be held in room Munich I at the Hilton Munich Airport. Below you can see the companies we have invited to present. Please note, there will be no public call for papers, the event is “invite only”. You can expect the contributions to be highly technical.

All times refer to time zone CET

Klick title to show / hide detailed session description

08:00
A5
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Opening
  Alfred Vollmer
 Editor-in-Chief
 Bodo’s Power Systems
(No session description available yet)
08:30
S1
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Presentation title to be confirmed
  Guy Moxey
 Senior Vice President, Business Development and Marketing
 Wolfspeed
To be confirmed…
08:45
S2
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Presentation title to be confirmed
  Speaker to be confirmed
 
 STMicroelectronics
To be confirmed…
09:00
S3
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Presentation title to be confirmed
  Dr. David Sheridan
 Vice President SiC Products
 Alpha and Omega Semiconductor
To be confirmed…
09:15
S4
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Presentation title to be confirmed
  Speaker to be confirmed
 
 Infineon
To be confirmed…
09:30
B1
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Coffee Break & Tabletop Exhibition
  
 
 
All breaks and catering, as well as the tabletop exhibition, will take place in the foyer.
The perfect spot for networking and learning about the latest products and services!
10:15
S5
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Presentation title to be confirmed
  Dr. Ajay Poonjal Pai
 Director of WBG Innovation & Application Engineering
 Sanan Semiconductors
To be confirmed…
10:30
S6
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Presentation title to be confirmed
  Alfred Hesener
 Senior Director Industrial and Consumer Applications
 Navitas
To be confirmed…
10:45
S7
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SiC Power Packaging Unlocks Full Potential of High-Power Applications
  Speaker to be confirmed
 
 Microchip Technology
The electrification of everything is driving the need for higher levels of power fidelity in applications such as sustainability, data centers and aerospace and defense. This presentation focuses on leveraging the latest, innovative SiC power packaging, which is crucial to unlock high system performance and enable high current, high power and efficient switching applications.
11:00
S8
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Presentation title to be confirmed
  Kiran Kumar Ramachandra
 FAE Manager
 Qorvo
To be confirmed…
11:15
S9
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Presentation title to be confirmed
  Francois Perraud
 Sr. Manager, Product Management - Discrete MOSFET, SI and SIC Products
 Littelfuse
To be confirmed…
11:30
S10
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(This slot is still available)
  Speaker to be confirmed
 
 
To be confirmed…
11:45
B2
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Lunch Break & Tabletop Exhibition
  
 
 
All breaks and catering, as well as the tabletop exhibition, will take place in the foyer.
The perfect spot for networking and learning about the latest products and services!
13:30
S11
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Presentation title to be confirmed
  Eugen Stumpf
 Senior Manager, Technical Marketing Medium and Low Power
 Mitsubishi Electric
To be confirmed…
13:45
S12
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Presentation title to be confirmed
  Emiliano Meza
 Senior Product Marketing Manager
 Semikron Danfoss
To be confirmed…
14:00
S13
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Presentation title to be confirmed
  Speaker to be confirmed
 
 ROHM Semiconductor
To be confirmed…
14:15
S14
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Accurate SiC Simulation in SPICE and PLECS
  Dr. Didier Balocco
 Technical Marketing Engineer
 onsemi
SiC is still a relative new material. Every new generation brings more performances to improve system or application efficiency. But, to compare or evaluate the advantage to move on, designer need tools to compare at system level the benefits. SPICE, invented in the 70’s, doesn’t know SiC material and specific characteristics. onsemi build all SiC physical equations to describe SiC operation and implement then in SPICE. With such powerful SPICE models, accurate simulation results can be obtained. For every designer, losses are the focus. As we will see in this session, onsemi SPICE models can predict then if the environment is also modeled. The drawback of SPICE is the simulation time need for big system. PLECS overcomes this by using a state change technic and models including precalculated losses. As it will be demonstrated in the previous section on SPICE, system losses don’t depend only on active devices. There are interactions between active and passive devices, influencing each other’s. For this, onsemi bring a new tool : the “Self-Service PLECS Model Generator” in complement with the “Elite Power Simulator” tool, a system simulation platform based on PLECS. The model generator objective is to predict accurately the losses by including in the PLECS models the system environment and interactions between each design specific passive and active parts. The second section will show examples and comparisons between SPICE results and PLECS results. It will prove the superior accuracy of using the model generator to predict system losses.
14:30
S15
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(This slot is still available)
  Speaker to be confirmed
 
 
To be confirmed…
14:45
B3
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Coffee Break & Tabletop Exhibition
  
 
 
All breaks and catering, as well as the tabletop exhibition, will take place in the foyer.
The perfect spot for networking and learning about the latest products and services!
15:30
S16
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Presentation title to be confirmed
  David Chilachava
 Technical Marketing Manager
 Vincotech
To be confirmed…
15:45
S17
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Presentation title to be confirmed
  Dr. Georgio El-Zammar
 SiC Senior Development Engineer
 Nexperia
To be confirmed…
16:00
S18
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Measuring accurately and safely on fast WBG testing environment
  Speaker to be confirmed
 
 Rohde & Schwarz
To be confirmed…
16:15
S19
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Presentation title to be confirmed
  Mike Sandyck
 Marketing Director
 CISSOID
To be confirmed…
16:30
S20
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Presentation title to be confirmed
  Speaker to be confirmed
 
 Infineon
To be confirmed…
16:45
S21
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(This slot is still available)
  Speaker to be confirmed
 
 
To be confirmed…