Day 2 - December 3th, 2025

Bodo's WBG - SiC

Welcome to the program for the SiC track, which will be held in room Munich I at the Hilton Munich Airport. Below you can see the companies we have invited to present. Please note, there will be no public call for papers, the event is “invite only”. You can expect the contributions to be highly technical.

All times refer to time zone CET

Klick title to show / hide detailed session description

08:15
A5
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Opening
  Roland R. Ackermann
 Correspondent Editor Bavaria
 Bodo’s Power Systems
(No session description available yet)
08:30
S1
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Silicon Carbide JFETs enable breakthroughs of high-voltage solid state power distribution
  Leo Aichriedler
 Distinguished Engineer Application Marketing
 Infineon Technologies
New, emerging low-voltage (< 1000VAC and < 1500VDC) power distribution schemes require fast-acting circuit protection devices, which are typically implemented as solid-state circuit breakers (SSCBs). Unlike conventional electromechanical breakers, SSCBs comprise semiconductor power switches enable the interruption of faulted circuits within sub-µs range. The employed power switch has to support low conduction losses during normal operation while also being capable to handle extreme overvoltage and overcurrent / short-circuit events in a reliable manner. To meet these specific requirements, Infineon Technologies has developed an application-tailored Silicon Carbide JFET technology that enables ultra-low RDSon (1mΩ - 5mΩ at 750V - 1.2kV VBDss) power devices in standard discrete packages. Starting from key requirements of SSCB applications, the presentation focuses on the specific features of the new JFET technology and demonstrates its performance using practical application measurements.
08:45
S2
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Presentation title to be confirmed…
  
 
 STMicroelectronics
To be confirmed…
09:00
S3
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Presentation title to be confirmed…
  
 
 Mitsubishi Electric
To be confirmed…
09:15
S4
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Presentation title to be confirmed…
  Dr. David Sheridan
 Vice President SiC Products
 Alpha and Omega Semiconductor
To be confirmed…
09:30
S5
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Presentation title to be confirmed…
  Dr. Virgiliu Botan
 Senior Product Manager BiMOS
 Hitachi Energy
To be confirmed…
09:45
B1
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Coffee Break & Tabletop Exhibition
  
 
 
All breaks and catering, as well as the tabletop exhibition, will take place in the foyer.
The perfect spot for networking and learning about the latest products and services!
10:30
S6
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Presentation title to be confirmed…
  
 
 ROHM Semiconductor
To be confirmed…
10:45
S7
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Presentation title to be confirmed…
  
 
 Vincotech
To be confirmed…
11:00
S8
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Presentation title to be confirmed…
  
 
 StarPower
To be confirmed…
11:15
S9
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Presentation title to be confirmed…
  
 
 HIOKI
To be confirmed…
11:30
S10
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Efficient and Reliable 2kV SiC Power Modules for DC Infrastructure and Renewables
  Dr. Jorge Mari
 Senior Principal Engineer
 Semikron Danfoss
With the objective of reducing direct current and associated conductor sizes, many applications have seen an incrase in the DC link voltage to up to 1500V. This is the case for utility-scale solar farms, Energy Storage Systems, electrolyzers for Hydrogen production, High Power EV chargers, Trucks and Off Highway Vehicles. With these applications in mind, all of which require a high reliability product, Semikron Danfoss has developed a 1700A 2kV SiC power module which is now in series production. The module exhibits a fantastic 0.8 mΩ forward resistance and thanks to its careful chip-layout exhibits stable text-book switching waveforms in all its voltage, current and temperature range. Through extensive qualification tests at chip and module level the module is best prepared for applications requiring reliable long life performance. In this talk we shall illustrate some of these features comparing its advantages over higher voltage modules.
11:45
S11
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Presentation title to be confirmed…
  
 
 Microchip
To be confirmed…
12:00
B2
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Lunch Break & Tabletop Exhibition
  
 
 
All breaks and catering, as well as the tabletop exhibition, will take place in the foyer.
The perfect spot for networking and learning about the latest products and services!
13:30
S12
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Comparative Analysis of Power and Thermal Performance in SiC MOSFET SMD Packages: X.PAK, QDPAK & D2PAK7
  Fatih Cetindag
 SiC Principal Power Application Engineer
 Nexperia
To be confirmed…
13:45
S13
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Assessing the aggregate behavior of paralleled SiC Mosfets
  Andrea Vinci
 Senior Technical Marketing Manager
 Tektronix
Tektronix will present the critical factors affecting current sharing in paralleled SiC Mosfets configurations, in particular when it’s needed to determine potential imbalances causing devices to overheat or fail prematurely
14:00
S14
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Presentation title to be confirmed…
  
 
 Toshiba Electronics
To be confirmed…
14:15
S15
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Presentation title to be confirmed…
  
 
 Bosch
To be confirmed…
14:30
S16
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Presentation title to be confirmed…
  
 
 Rohde & Schwarz
To be confirmed…
14:45
B3
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Coffee Break & Tabletop Exhibition
  
 
 
All breaks and catering, as well as the tabletop exhibition, will take place in the foyer.
The perfect spot for networking and learning about the latest products and services!
15:30
S17
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Presentation title to be confirmed…
  
 
 Fuji Electric
To be confirmed…
15:45
S18
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Presentation title to be confirmed…
  
 
 CISSOID
To be confirmed…
16:00
S19
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Presentation title to be confirmed…
  
 
 onsemi
To be confirmed…
16:15
S20
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Presentation title to be confirmed…
  
 
 Sanan Semiconductor
To be confirmed…
16:30
S21
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Presentation title to be confirmed…
  
 
 APEX
To be confirmed…