Conference Bag

Like last year, we're 100% digital with our conference bags! Each partner logo provides access to valuable materials from our sponsors, enhancing your exhibition experience. You'll also find the conference proceedings available on this page.

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Exhibitor Materials/Brochures

Explore the promotional materials from our exhibitors to revisit the highlights of your time in Munich.

Conference Proceedings

You may download individual session PDFs for your convenience or access the complete collection of proceedings from the 2025 conference below.

We will constantly update this page with the proceedings as they will be provided by the speakers.

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S1
  Leo Aichriedler (Infineon Technologies)
  Silicon Carbide JFETs enable breakthroughs of high-voltage solid state power distribution
S2
  Salvatore La Mantia (STMicroelectronics)
  Paralleling SiC MOSFETs: A Robust Approach for High-Power Converter Performance and Thermal Management
S4
  Dr. Tomas Krecek (Alpha and Omega Semiconductor)
  Selection and Optimization of Topside Cooling Options for Discrete SiC MOSFETs for High Power Density Applications
S5
  Dr. Virgiliu Botan (Hitachi Energy)
  Design and Reliability Considerations for 3.3kV SiC Modules in Traction
S6
  Dr. Christian Felgemacher (ROHM Semiconductor)
  Increasing power density with small molded modules in medium power applications
S7
  Dr. Darko Vračar (The Exploration Company)
  SiC semiconductors in space applications: trends, challenges and opportunities
S8
  Dr. Andrei Mihaila  (StarPower)
  Advanced SiC technology for automotive applications
S9
  Roy Hali (HIOKI)
  Accurate Efficiency Analysis for WBG inverters: Confidently Capturing 0.1% Improvements
S10
  Dr. Jorge Mari (Semikron Danfoss)
  Efficient and Reliable 2kV SiC Power Modules for DC Infrastructure and Renewables
S11
  Fatih Cetindag (Nexperia)
  Comparative Analysis of Power and Thermal Performance in SiC MOSFET SMD Packages: X.PAK, QDPAK & D2PAK-7
S13
  Dr. Rosemary O’Keeffe (Bourns)
  The Application of Miniature Planar Gate Drive Transformers
S14
  Karsten Düchting (Allegro MicroSystems )
  Beyond the FET: Solving the Practical Challenges of SiC Gate Drive Design
S15
  Hadiuzzaman Syed (Bosch)
  SiC MOSFET Gen 2.0: Rugged in Radiation, Softer in switching
S16
  Sascha Dern (Navitas Semiconductor)
  Performance and Reliability Gains in MVHV SiC Using Advanced Power Devices and Packaging Technologies
S17
  Sebastian Pawusch  (Fuji Electric)
  Benefits of 3-level power modules in Automotive traction inverters
S18
  Andrea Vinci (Tektronix)
  Assessing the aggregate behavior of paralleled SiC Mosfets
S19
  Dr. Didier Balocco (onsemi)
  Next-Gen Motor Drives : Exploring SiC
S20
  Dr. Ajay Poonjal Pai (Sanan Semiconductor)
  Selecting the Right SiC MOSFET Device: A Key to Efficient Zero-Voltage Switching
S21
  Mauro Ceresa (Wolfspeed)
  Going Beyond a Qualification Report: Power Cycling and Lifetime Modeling
G1
  Sebastian Klötzer (Nexperia)
  GaN In-Circuit Reliability: Dynamic Life Testing of 650 V GaN FETs
G2
  Dr. Alex Lidow (Efficient Power Conversion (EPC))
  GaN Integrated Circuits for Motor Drives
G3
  Harald Parzhuber (Texas Instruments)
  Power conversion with bi-directional GaN in a single stage converter for micro inverters and portable power stations
G4
  Dr. Edward A. Jones (Infineon Technologies)
  GaN bidirectional switch (BDS) innovation and related applications
G5
  Eli Hanak (Plexim)
  PLECS meets Spice: One Model. From Systems to Semiconductors.
G6
  Dr. Ester Spitale (STMicroelectronics)
  Compact, lightweight, and cost-effective high-voltage motor control inverter with GaN
G7
  Patrick Minton (X-FAB)
  The GaN Foundry Model: A GameChanger for the Next Wave of Innovation
G8
  Dr. Timothy Polom  (ROHM Semiconductor)
  Driving integration – Compact power supplies with the GaN System-In-Package
G9
  Bétina Bebey (NXP Semiconductors)
  The adoption of GaN technologies for EV traction inverter solutions
G10
  Marco Ruggeri (Renesas Electronics)
  From Back-to-Back to Monolithic: The Role of GaN BDS in Next-Generation Power Electronics
G11
  Llew Vaughan-Edmunds (Navitas Semiconductor)
  High-Power GaN ICs & FETs Enable Efficiency and Power Density Requirements in Next Gen 800V AI Data Centers
G12
  Dr. Subhash Pidaparthi (onsemi)
  Vertical GaN: Breakthrough for AI & Automotive Electrification
G13
  Andrew Smith (Power Integrations)
  High Voltage GaN: Delivering 800 V DC bus architectures for Power-Hungry Data Centers
G14
  Pierrick Ausseresse (Infineon Technologies)
  HV Intermediate bus converter as essential link to power server boards directly from 800V DC
G15
  Dieter Liesabeths (VisIC Technologies )
  GAN Power Module for high power BEV Inverter Applications
G16
  Dr. Samaneh Sharbati (University of Southern Denmark)
  Advancing GaN Power Device Technology: Theoretical Insights into Reliability, Switching Behavior, and Device-Level Design Optimization
G17
  Dr. Stefania Carapezzi (Silvaco)
  Improving GaN Model Accuracy
G18
  Farhan Beg (Cambridge GaN Devices (CGD))
  Unlocking the Potential of Multi-level Inverters with Integrated GaN technologies
G19
  David Czajkowski (MinDCet)
  Fully Integrated GaN Solutions with Monolithic GaN-Ics
G20
  Dr. Maik Kaufmann (Texas Instruments)
  Package-integrated GaN motor drive IPM exceeding 99% efficiency at 250W
G21
  Dr. Roy Dagher (YOLE)
  GaN at the Tipping Point: from Market expansion to OEM adoption